C10100 High-Purity Oxygen-Free Copper

From semiconductor lead frames to vacuum devices, from sputtering targets to precision custom components —

KINMACHI delivers stable, reliable conductive and thermal substrate materials for high-end manufacturing, backed by 4N-grade purity and full-form supply capability.

I. Product Introduction

II. Core Technical Specifications

ItemSpecification / DescriptionRemarks
GradeOxygen Free Copper C10100 (OFE)Internationally recognized high-purity oxygen-free copper grade
Copper Content (Cu+Ag)≥ 99.99% (4N grade)Extremely high purity, minimal impurities
Oxygen Content< 3 ppmOxygen-free melting technology prevents hydrogen embrittlement
Conductivity≥ 102.5% IACSExcellent electrical performance
Impurity ControlP, Bi, Sb, As, Fe, Pb, Ni, Sn, S, Zn all ≤ 0.0003%Precise trace-element control
Grain SizeUniform, fine grain; customizableMeets diverse processing and forming requirements

III. Chemical composition

ItemCuAgAsBiCdFeMnNiOPPbSSbSeSnTeZn
Min99.99                
Max0.00250.00050.00020.00010.0010.00050.0013ppm0.00030.00050.00150.00040.00020.00020.00020.0001

IV. Product Forms & Applications

Sheet & Strip Suitable for semiconductor lead frames, electronic component heat sinks, and glass-to-metal seals — applications with stringent requirements for conductivity, thermal performance, and dimensional precision.Tube, Rod & Wire Suitable for vacuum device structural parts, high-conductivity cables, and precision instrument components, combining high purity with excellent machinability.
Sputtering Target Suitable for semiconductor sputtering processes, optical coatings, cavity resonators, and superconductor substrates, meeting high-end coating purity requirements.Custom Forms Copper granules, chip heat-dissipation heat pipes, and other custom-shaped parts, flexibly formed to customer structural and process requirements.

V. Why KINMACHI

20+ Years of Process Expertise Sustained investment in advanced production equipment and process R&D, with deep insight into the evolving material needs of the electronics industry.
Pioneering Oxygen-Free Melting Process Oxygen content strictly controlled below 3 ppm and hydrogen below 1 ppm, eliminating porosity and hydrogen-embrittlement risk at the source — industry-leading material purity.
10–50 Zone-Refining Purification Passes An ultimate impurity-removal process combined with PPB-level precision testing capability ensures stable delivery of high conductivity and other key performance metrics.
One-Stop Full-Form Supply Sheet & strip, tube/rod/wire, sputtering targets, and custom-shaped parts — one supplier covers every form across the value chain, reducing multi-vendor coordination costs.
Rapid Response & Customization Supports small-batch sampling and custom shaping, adapting to the fast-iteration needs of new product development.

Share the Post:
Scroll to Top

Get a quote Immediately