From terminals, connectors, switches, relays to submarine and coaxial cables, and from semiconductor carriers, thermal plates to vacuum gaskets and tube anodes –

KINMACHI offers C10200 OFC for high-end manufacturing, delivering reliable conductivity and thermal performance for electrical, electronic, and vacuum applications.

I. Product Introduction

Core Positioning:
C10200 is a high-purity, oxygen-free, phosphorus-deoxidized copper that contains no vacuum-evaporated elements. It offers exceptional electrical and thermal conductivity, minimal or no “hydrogen disease,” outstanding workability, excellent weldability, and strong corrosion resistance. With 100% IACS electrical conductivity, it is ideally suited for thermal treatments such as welding and brazing – requiring no special precautions due to the complete absence of hydrogen embrittlement risk.

Key Features (based on material properties):

• Ultra-high purity with superior conductive and thermal performance
• No or negligible susceptibility to hydrogen embrittlement
• Excellent formability, joining, and anti-corrosion characteristics
• Suitable for demanding applications without process limitations

 PPB-level precision testing capability, we guarantee reliable delivery of high-conductivity oxygen-free copper.

II. Core Technical Specifications

KINMACHI enforces strict full-process control over the key physical and chemical parameters of C10200, ensuring every batch meets the stringent requirements of electrical and electronic components applications:

Item	Specification / Description	Remarks
Grade	Oxygen Free Copper C10200 (OF)	Internationally recognised high‑purity oxygen‑free copper grade; equivalent to JIS C1020, DIN OF‑Cu/2.0040, EN Cu‑OF/CW008A
Copper Content (Cu+Ag)	≥ 99.95 %	High‑purity copper; silver content is counted as copper
Oxygen Content	≤ 0.001 % (≤ 10 ppm)	Oxygen‑free melting process effectively prevents hydrogen embrittlement

III. Product Applications

C10200 oxygen‑free copper is widely used in: terminals, connectors, switches, relays and other electronic components; submarine and coaxial cables; vacuum gaskets, vacuum tube anodes and vacuum parts; semiconductor carriers and heat spreaders. It is also suitable for high‑voltage contacts, military & aerospace components, and ceramic substrates (e.g., AMD processor packaging) where high reliability and heat dissipation are critical.