C52400
C52400
Standard
| JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
| C5240 | CuSn10 | CuSn10 | C52400 | / |
Merit
Applications
Miniaturised connectors Contact springs Relay springs
| Cu | Remainder |
| Sn | 10 |
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| Temper | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) |
| H | 650-750 | 580min | 11min | 200-240 |
| EH | 750-850 | 650min | 9min | 230-270 |
| SH | 850-950 | 780min | 5min | 250-300 |
| ESH* | 950-1050 | 900min | 1min | 290min |
| XSH* | 1000-1200 | 950min | 1min | 290min |
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly，we will give you professional assessments and answers.
| Density (g/cm³) | 8.8 |
| Electrical conductivility IACS%(20℃)* | 10 |
| Modulus of elasticity (KN/mm²) | 105 |
| Coefficient of thermal expansion 10-6/K | 18.5 |
| Thermal conductivity W/(m*K) | 50 |
*value for the lowest temper class
JIS: C5240
DIN: CuSn10
EN: CuSn10
UNS: C52400
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