C70250
C70250
Standard
| JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
| C7025 | CuNi3SiMg | CuNi3SiMg | C70250 | / |
Merit
Good corrosion resistance in nature atmosphere and industrial atmosphere. It is good at stress corrosion cracking.
Applications
Components for electrical industry connectors Relay springs Springs Semiconductor components
| Cu | min. 96.2 |
| Ni | 2.2-4.2 |
| Si | 0.25-1.2 |
| Mg | 0.05-0.3 |
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| Temper | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) | Bending Test(90°)GW | Bending Test(90°)BW |
| R620 | 620-760 | min. 500 | min. 10 | 180-240 | 0 | 0 |
| R650 | 650-825 | min. 585 | min. 7 | 190-250 | 1 | 1 |
| R690 | 690-860 | min. 655 | min. 5 | 220-260 | 1.5 | 1.5 |
| R760 | 760-840 | min. 720 | min. 7 | 210-250 | 3 | 3 |
| TR02 | 608-725 | 550-650 | min. 6 | 180-220 | 1 | 3 |
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly，we will give you professional assessments and answers.
| Density (g/cm³) | 8.82 |
| Electrical conductivility IACS%(20℃)* | 40 |
| Modulus of elasticity (KN/mm²) | 127 |
| Coefficient of thermal expansion 10-6/K | 17.7 |
| Thermal conductivity W/(m*K) | 190 |
*value for the lowest temper class
JIS: C7025
DIN: CuNi3SiMg
EN: CuNi3SiMg
UNS: C70250
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