C72900
C72900
Standard
| JIS | DIN | EN | ASTM/UNS/CDA | GB/T |
| / | CuNi15Sn8 | CuNi15Sn8 / CW355H | C72900/ASTM B740 | / |
Merit
High strength and high hardness, non-magnetic, non-hydrogen brittleness, excellent wear resistance, high performance at temperatures from -125°C to 300°C, high pressure resistance and excellent fatigue resistance.
Applications
Typical application: focus spring (etching material) of camera VCM motor,Sensors, Terminals, etc.
| Cu | Remainder |
| Ni | 14.5-15.5 |
| Sn | 7.5-8.5 |
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| Temper | Thickness(mm) | Tensile Strength(Mpa) | Yield Strength(Mpa) | Elongation (%) | Hardness(HV) |
| TM00 | 0.04 | 655-792 | 517-655 | 22-36 | 190-290 |
| TM02 | 0.05 | 723-862 | 620-758 | 15-30 | 215-315 |
| TM04 | 0.06 | 792-930 | 723-862 | 10-24 | 245-345 |
| TM06 | 0.08 | 896-1034 | 827-999 | 6-16 | 270-370 |
| TM08 | 0.1 | 1034-1226 | 965-1171 | 2-10 | 305-405 |
Physical properties of the above materials are conventional performance indicators.If you have some special requirements,(for example property and tolerance).please contact Kinmachi Company directly,we will give you professional assessments and answers.
| Density (g/cm³) | 8.92 |
| Electrical conductivility IACS%(20℃)* | 7 |
| Modulus of elasticity (KN/mm²) | 128 |
| Coefficient of thermal expansion 10-6/K | 16.4 |
| Thermal conductivity W/(m*K) | 29 |
*value for the lowest temper class
DIN: CuNi15Sn8
EN: CuNi15Sn8 / CW355H
UNS: C72900/ASTM B740
- Sophia
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