Material Solutions for Lead Frames and Sensor Packaging
I. Product Introduction
As semiconductor packaging continues to evolve toward miniaturization, higher density, and higher power, lead frames serve as critical metallic structural components that not only transmit electrical signals but also provide die attachment, heat dissipation, mechanical support, and external interconnection. Lead frames are typically manufactured from copper, copper alloy, or Fe-Ni alloy strip, with fine structures formed by stamping or chemical etching. These processes impose stringent requirements on electrical and thermal conductivity, strength, etching precision, and dimensional stability.
Shanghai Kinmachi New Material Technology Co., Ltd. offers four high-performance copper alloy etching materials – C15100, C19210, C19400, and C7025 – together with FeNi42 iron-nickel alloy, providing comprehensive support for semi-etching and full-etching lead frame manufacturing. These materials are suitable for high-end applications such as QFN/DFN packaging, precision etched lead frames, sensors, and vacuum interrupters.
Copper Alloy Series:
The four copper alloys form a gradient in conductivity, strength, and heat dissipation, offering flexible selection options. C15100 is distinguished by ultra-high conductivity and thermal performance; C19210 combines high conductivity with high strength; C19400, as a classic Cu-Fe-P alloy, delivers the most balanced overall performance; and C7025 achieves an exceptional combination of ultra-high strength and good conductivity through Cu-Ni-Si precipitation hardening.
FeNi42 Iron-Nickel Alloy:
FeNi42 (also known as Alloy 42) is a nickel-iron based low-expansion alloy containing approximately 42% nickel. Its key characteristic is a low and highly stable coefficient of thermal expansion (CTE). Over the temperature range of 30–300°C, its linear CTE is only 4.0–4.7 × 10⁻⁶/°C, which closely matches the thermal expansion behavior of borosilicate glass and ceramics. This makes it an ideal material for reliable glass-to-metal and ceramic-to-metal sealing. It is widely used in sensors, semiconductor packaging, vacuum interrupters, and high-precision electronic devices
II. Core Technical Specifications
The core value of FeNi42 lies in its precise thermal expansion match with glass and ceramic packaging materials. This effectively reduces thermal stress at sealing interfaces and ensures the reliability and long-term stability of hermetic seals. The alloy exhibits highly stable thermal expansion behavior below 300°C, making it an ideal choice for glass-to-metal sealing, semiconductor packaging, and precision sensor manufacturing.
| Parameter | C15100 | C19210 | C19400 | C7025 |
| Alloy System | Cu-Zr | Cu-Fe-P | Cu-Fe-P | Cu-Ni-Si |
| Standard Equivalents | UNS C15100 / JIS C1510 | UNS C19210 / JIS C1921 | UNS C19400 / JIS C1940 | UNS C70250 / JIS C7025 |
| Key Advantages | Conductivity approaching pure copper while maintaining higher strength | Balanced high conductivity and high strength, excellent cold formability | Balanced combination of strength, conductivity, etchability, and platability | Precipitation-hardened, ultra-high strength and excellent stress relaxation resistance |
| Typical Applications | High-heat-dissipation power devices, high-conductivity lead frames | Lead frames, connector tabs, automotive battery clamps | General-purpose lead frames, connectors, semiconductor lead frames | LSI lead frames, 5G equipment, high-end Type-C connectors |
These four copper alloy etching materials are suitable for both semi-etching and full-etching lead frame manufacturing processes. Among them, C19400 and C7025 offer outstanding strength control, making them ideal for fine-pitch and high-reliability packaging applications. C15100 is more oriented toward high thermal conductivity and high heat dissipation scenarios.
FeNi42’s thermal expansion curve is similar to that of many soft glasses (such as electric vacuum glass) and certain ceramics, enabling reliable glass-to-metal or ceramic-to-metal sealing. It is widely used in electron tubes, integrated circuit packaging, and other hermetic sealing applications.
III. Partnership Benefits
| Flexible dimensional customization for strip and rod forms For rods, we optimize diameter, length, and tolerances; for strips, we tailor width, thickness, and coil length. All dimensions can be adjusted to your application, supporting diverse needs in automotive electronics, connectors, and precision parts. |
| Designed for precision turning Compatible with CNC and turning processes; delivers tight tolerances and consistent machinability, minimizes post‑processing difficulties, and improves throughput. |
| Full‑cycle technical support From material selection and property matching to sample validation; we help refine your design, cut development time, and enable swift material adoption. |
Technical Consultation & Selection Support
If you are evaluating material solutions for lead frames, vacuum device structural components, sensor packaging, or other high-conductivity and high-thermal-conductivity applications, please contact the technical team at Shanghai Kinmachi New Material Technology Co., Ltd.
